Blind Via vs Buried Via
As technology advances, the demand for smaller and more complex printed circuit boards (PCBs) increases. And when it comes to PCB manufacturing, two terms that you may have heard are "blind via" and "buried via". But what are these terms, and how do they differ? In this post, we'll provide a factual comparison of blind via vs buried via PCBs so that you know which type to use in different scenarios.
Blind Via
A blind via is a type of via that starts from the top or bottom layer of a PCB, but it only goes down to a certain depth before it stops. The rest of the via is not visible on any other layer of the board. Generally, blind vias are used for high-density designs when component placement is done on opposite sides of the board.
The advantage of blind vias is that they allow for a larger circuit to be squeezed into a smaller space, thus increasing the overall density of the PCB. Additionally, the cost of drilling holes decreases as the size of the hole decreases, so using blind vias can be more cost-effective than using through-hole vias.
Buried Via
A buried via, on the other hand, does not go all the way through the PCB. Instead, it starts and ends inside the layers of the board. This type of via is more cost-effective than using blind vias because it requires fewer drilling steps. Buried vias also allow for a higher density of components on the surface of the board because they don't take up any surface area.
Comparison
When it comes to choosing between blind vias and buried vias, it really depends on the specific requirements of your project. Blind vias are best used for high-density designs that require component placement on opposite sides of the board, while buried vias are more cost-effective and space-efficient. Below is a table summarizing the differences between the two types of vias.
| Blind Via | Buried Via | |
|---|---|---|
| Starting Layer | Top or Bottom | Inner Layer |
| Ending Layer | Inner Layer | Inner Layer |
| Usage | Increased Density | Cost-Effective |
| Drill Steps | Multiple | None (Drilled during layer formation) |
| Surface Area | Reduced | None |
Conclusion
In conclusion, blind vias and buried vias each have their own advantages and disadvantages. Blind vias allow for increased density, while buried vias are more cost-effective and space-efficient. When deciding which type of via to use, consider your project's specific requirements to determine which will work best.
We hope this comparison has been helpful! If you have any questions or would like more information, feel free to reach out to a PCB manufacturer or supplier.
References
- "Blind and Buried Vias Explained" by Advanced Circuits
- "What is the difference between blind vias and buried vias?" by Sierra Circuits